Dawn Research, Inc.
PARAMETER Electrodeposited Ni Electroless Ni NiP NiCoP
Plating Temp C 38 - 50 82 - 90 45 - 60 40 - 60
Control Method Soluble Anode Chemical Replenish Soluble Anode Soluable Ni & Co
Yield (0.2%) (MPa) 500 See UTS See UTS See UTS
Microyield (MPa) 70 500 + 830 + 900
UTS Max (MPa) 800 850 1800 - 2150 1800 - 2500
Specific Gravity 8.9 7.8 - 8.0 7.8 - 8.0 7.8 - 8.0
Stress Control (Real Time) Yes No Yes Yes
Hardness (Rockwell C) 22 - 24 48 - 52 48 - 52 55 - 64
Diamond Machining No Yes Yes Limited
Thick Deposits Yes No Yes Yes
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